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During Patrick Gelsinger’s keynote at the Intel Developer Forum (IDF) today, Intel made a small announcement regarding a group of companies who are now working together to create a “superspeed personal USB interconnect” with 10 times the speed of the current generation technology of USB 2.0.  The USB 3.0 Promoter Group — which consists of Intel, Hewlett-Packard, NEC Corporation, NXP Semiconductors, Microsoft and Texas Instruments — looks to make several other major changes. More about it can be found here.